TS(X)PC860MHVGU66(A) vs XPC860MHZP66C1 feature comparison

TS(X)PC860MHVGU66(A) Teledyne e2v

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XPC860MHZP66C1 Freescale Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ATMEL GRENOBLE FREESCALE SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description , BGA,
Pin Count 357 357
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan NO
External Data Bus Width 32 32
Format FIXED POINT
Integrated Cache NO
JESD-30 Code S-CBGA-B357 S-PBGA-B357
Low Power Mode NO
Number of Terminals 357 357
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Speed 66 MHz 66 MHz
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Position BOTTOM BOTTOM
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1
ECCN Code 5A991
Clock Frequency-Max 66 MHz
Length 25 mm
Package Code BGA
Seated Height-Max 2.05 mm
Supply Voltage-Max 3.465 V
Supply Voltage-Min 3.135 V
Terminal Pitch 1.27 mm
Width 25 mm

Compare TS(X)PC860MHVGU66(A) with alternatives

Compare XPC860MHZP66C1 with alternatives