TS(X)PC860MHMZPB/Q50C
vs
MPC860SRZQ80D4
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
THOMSON-CSF SEMICONDUCTORS
FREESCALE SEMICONDUCTOR INC
Part Package Code
BGA
BGA
Package Description
PLASTIC, BGA-357
25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357
Pin Count
357
357
Reach Compliance Code
unknown
not_compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
50 MHz
50 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B357
S-PBGA-B357
Low Power Mode
NO
YES
Number of Terminals
357
357
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Speed
50 MHz
80 MHz
Supply Voltage-Max
3.465 V
3.465 V
Supply Voltage-Min
3.135 V
3.135 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
Terminal Form
BALL
BALL
Terminal Position
BOTTOM
BOTTOM
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR, RISC
Base Number Matches
2
2
Pbfree Code
Rohs Code
JESD-609 Code
e0
Length
25 mm
Moisture Sensitivity Level
3
Package Equivalence Code
BGA357,19X19,50
Peak Reflow Temperature (Cel)
245
Seated Height-Max
2.52 mm
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Pitch
1.27 mm
Time@Peak Reflow Temperature-Max (s)
30
Width
25 mm
Compare TS(X)PC860MHMZPB/Q50C with alternatives
Compare MPC860SRZQ80D4 with alternatives