TR80C186XL-20
vs
MC68EC000FN16
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEL CORP
FREESCALE SEMICONDUCTOR INC
Part Package Code
LCC
LCC
Package Description
CERAMIC, LCC-68
PLASTIC, LCC-68
Pin Count
68
68
Reach Compliance Code
unknown
compliant
Address Bus Width
20
24
Bit Size
16
32
Boundary Scan
NO
NO
Clock Frequency-Max
40 MHz
16.67 MHz
External Data Bus Width
16
16
Format
FIXED POINT
FIXED POINT
Integrated Cache
NO
NO
JESD-30 Code
S-CQCC-N68
S-PQCC-J68
Length
24.13 mm
24.2062 mm
Low Power Mode
YES
NO
Number of DMA Channels
2
Number of External Interrupts
5
Number of Serial I/Os
Number of Terminals
68
68
On Chip Data RAM Width
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
QCCN
QCCJ
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER
CHIP CARRIER
Qualification Status
Not Qualified
Not Qualified
RAM (words)
0
Seated Height-Max
3.68 mm
4.57 mm
Speed
20 MHz
16.67 MHz
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
NO LEAD
J BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Width
24.13 mm
24.2062 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR
Base Number Matches
1
3
Rohs Code
ECCN Code
EAR99
HTS Code
8542.31.00.01
JESD-609 Code
e0
Moisture Sensitivity Level
3
Package Equivalence Code
LDCC68,1.0SQ
Peak Reflow Temperature (Cel)
220
Supply Current-Max
25 mA
Supply Voltage-Max
5.25 V
Supply Voltage-Min
4.75 V
Terminal Finish
TIN LEAD
Time@Peak Reflow Temperature-Max (s)
30
Compare TR80C186XL-20 with alternatives
Compare MC68EC000FN16 with alternatives