MC68EC000FN16
vs
C80186-6
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MOTOROLA INC
ADVANCED MICRO DEVICES INC
Package Description
PLASTIC, LCC-68
CERAMIC, LCC-68
Reach Compliance Code
unknown
compliant
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
24
20
Bit Size
32
16
Boundary Scan
NO
NO
Clock Frequency-Max
16.67 MHz
12 MHz
External Data Bus Width
16
16
Format
FIXED POINT
FIXED POINT
Integrated Cache
NO
NO
JESD-30 Code
S-PQCC-J68
S-CQCC-N68
JESD-609 Code
e0
e0
Length
24.2062 mm
24.13 mm
Low Power Mode
NO
NO
Number of DMA Channels
2
Number of External Interrupts
7
5
Number of Serial I/Os
Number of Terminals
68
68
On Chip Data RAM Width
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
QCCJ
QCCN
Package Equivalence Code
LDCC68,1.0SQ
LCC68A,.95SQ
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER
CHIP CARRIER
Qualification Status
Not Qualified
Not Qualified
RAM (words)
0
0
Seated Height-Max
4.57 mm
3.048 mm
Speed
16.67 MHz
6 MHz
Supply Current-Max
50 mA
550 mA
Supply Voltage-Max
5.25 V
5.5 V
Supply Voltage-Min
4.75 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
MOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
J BEND
NO LEAD
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Width
24.2062 mm
24.13 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR
Base Number Matches
3
2
Part Package Code
LCC
Pin Count
68
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