TPS65994ADRSLR
vs
LTC2963CUDC-1#PBF
feature comparison
Pbfree Code |
Yes
|
No
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
ANALOG DEVICES INC
|
Package Description |
HVQCCN, LCC48,.24SQ,16
|
QFN-20
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
|
Date Of Intro |
2020-09-20
|
2018-08-02
|
Samacsys Manufacturer |
Texas Instruments
|
Analog Devices
|
Additional Feature |
IT ALSO HAS 4.9 TO 5.5 AND 4 TO 22 SUPPLY VOLTAGE
|
|
Adjustable Threshold |
YES
|
YES
|
Analog IC - Other Type |
POWER SUPPLY MANAGEMENT CIRCUIT
|
POWER SUPPLY MANAGEMENT CIRCUIT
|
JESD-30 Code |
S-PQCC-N48
|
R-PQCC-N20
|
JESD-609 Code |
e4
|
e3
|
Length |
6 mm
|
4 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Channels |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
48
|
20
|
Operating Temperature-Max |
125 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Equivalence Code |
LCC48,.24SQ,16
|
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Seated Height-Max |
1 mm
|
0.8 mm
|
Supply Current-Max (Isup) |
12 mA
|
|
Supply Voltage-Max (Vsup) |
3.6 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
3 V
|
2.25 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
AUTOMOTIVE
|
COMMERCIAL
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
Matte Tin (Sn)
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.4 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
6 mm
|
3 mm
|
Base Number Matches |
1
|
1
|
Pin Count |
|
20
|
Manufacturer Package Code |
|
05-08-1742
|
Technology |
|
CMOS
|
|
|
|
Compare TPS65994ADRSLR with alternatives
Compare LTC2963CUDC-1#PBF with alternatives