TPS65994ADRSLR
vs
BQ27411DRZR-G1B
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Package Description |
HVQCCN, LCC48,.24SQ,16
|
SON-12
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Date Of Intro |
2020-09-20
|
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Additional Feature |
IT ALSO HAS 4.9 TO 5.5 AND 4 TO 22 SUPPLY VOLTAGE
|
|
| Adjustable Threshold |
YES
|
YES
|
| Analog IC - Other Type |
POWER SUPPLY MANAGEMENT CIRCUIT
|
POWER SUPPLY MANAGEMENT CIRCUIT
|
| JESD-30 Code |
S-PQCC-N48
|
R-PDSO-N12
|
| JESD-609 Code |
e4
|
e4
|
| Length |
6 mm
|
4 mm
|
| Moisture Sensitivity Level |
1
|
2
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
48
|
12
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
HVSON
|
| Package Equivalence Code |
LCC48,.24SQ,16
|
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
1 mm
|
1 mm
|
| Supply Current-Max (Isup) |
12 mA
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
4.5 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
2.45 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.6 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.4 mm
|
0.4 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
6 mm
|
2.5 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare TPS65994ADRSLR with alternatives
Compare BQ27411DRZR-G1B with alternatives