TPS62000YEGR
vs
SP6651AER
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
SIPEX CORP
|
| Part Package Code |
BGA
|
|
| Package Description |
DSBGA-12
|
HVSSON,
|
| Pin Count |
12
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Additional Feature |
PFM CONTROL TECHNIQUE IS ALSO POSSIBLE
|
|
| Analog IC - Other Type |
SWITCHING REGULATOR
|
SWITCHING REGULATOR
|
| Control Mode |
CURRENT-MODE
|
|
| Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
| Input Voltage-Max |
5.5 V
|
5.5 V
|
| Input Voltage-Min |
2 V
|
2.7 V
|
| Input Voltage-Nom |
3.6 V
|
3.6 V
|
| JESD-30 Code |
R-XBGA-B12
|
S-PDSO-N10
|
| Length |
2.25 mm
|
3 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
12
|
10
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Current-Max |
1.6 A
|
2 A
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
HVSSON
|
| Package Equivalence Code |
BGA12,3X4,20
|
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
240
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.625 mm
|
1 mm
|
| Surface Mount |
YES
|
YES
|
| Switcher Configuration |
BUCK
|
BUCK
|
| Switching Frequency-Max |
1000 kHz
|
|
| Technology |
MOS
|
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
1.75 mm
|
3 mm
|
| Base Number Matches |
1
|
5
|
| JESD-609 Code |
|
e0
|
| Moisture Sensitivity Level |
|
1
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare TPS62000YEGR with alternatives
Compare SP6651AER with alternatives