TPADGN vs 935280938027 feature comparison

TPADGN Texas Instruments

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935280938027 NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC NXP SEMICONDUCTORS
Package Description HTSSOP, 2.06 X 2.11 MM, 0.60 MM HEIGHT, WLCSP-16
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Bandwidth-Nom 20 kHz 20 kHz
Consumer IC Type AUDIO AMPLIFIER CLASS D AUDIO AMPLIFIER
Harmonic Distortion 0.1%
JESD-30 Code S-PDSO-G8 R-PBGA-B16
Length 3 mm 2.11 mm
Number of Channels 2 2
Number of Functions 1 1
Number of Terminals 8 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Power-Nom 0.07 W 1.3 W
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HTSSOP VFBGA
Package Shape SQUARE RECTANGULAR
Package Style SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Qualification Status Not Qualified
Seated Height-Max 1.07 mm 0.64 mm
Supply Current-Max 3 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING BALL
Terminal Pitch 0.65 mm 0.5 mm
Terminal Position DUAL BOTTOM
Width 3 mm 2.06 mm
Base Number Matches 1 1
Gain 24 dB
Package Equivalence Code BGA16,4X4,20

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