TP3067V/NOPB
vs
ETC5067D
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
STMICROELECTRONICS
|
| Part Package Code |
QFN
|
SOIC
|
| Package Description |
QCCJ, LDCC20,.4SQ
|
SO-20
|
| Pin Count |
20
|
20
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Companding Law |
A-LAW
|
A-LAW
|
| Filter |
YES
|
YES
|
| Gain Tolerance-Max |
0.15 dB
|
0.15 dB
|
| JESD-30 Code |
S-PQCC-J20
|
R-PDSO-G20
|
| JESD-609 Code |
e3
|
e4
|
| Length |
8.89 mm
|
12.8 mm
|
| Linear Coding |
NOT AVAILABLE
|
NOT AVAILABLE
|
| Moisture Sensitivity Level |
3
|
|
| Neg Supply Voltage-Nom |
-5 V
|
-5 V
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
20
|
| Operating Mode |
SYNCHRONOUS/ASYNCHRONOUS
|
SYNCHRONOUS/ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
SOP
|
| Package Equivalence Code |
LDCC20,.4SQ
|
SOP20,.4
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.57 mm
|
2.65 mm
|
| Supply Current-Max |
10 mA
|
10 mA
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Telecom IC Type |
PCM CODEC
|
PCM CODEC
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
Matte Tin (Sn)
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
J BEND
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
8.89 mm
|
7.5 mm
|
| Base Number Matches |
1
|
2
|
|
|
|
Compare TP3067V/NOPB with alternatives
Compare ETC5067D with alternatives