TP3022B vs BLV193 feature comparison

TP3022B Motorola Mobility LLC

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BLV193 NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC NXP SEMICONDUCTORS
Package Description FLANGE MOUNT, R-CDFM-F6 FLANGE MOUNT, R-CDFM-F6
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.29.00.75 8541.29.00.75
Collector-Base Capacitance-Max 25 pF
Configuration SINGLE SINGLE
DC Current Gain-Min (hFE) 15 25
Highest Frequency Band ULTRA HIGH FREQUENCY BAND ULTRA HIGH FREQUENCY BAND
JESD-30 Code R-CDFM-F6 R-CDFM-F6
Number of Elements 1 1
Number of Terminals 6 6
Operating Temperature-Max 200 °C 200 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Shape RECTANGULAR RECTANGULAR
Package Style FLANGE MOUNT FLANGE MOUNT
Polarity/Channel Type NPN NPN
Power Dissipation Ambient-Max 29 W 44 W
Power Gain-Min (Gp) 8.5 dB 6.5 dB
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Terminal Form FLAT FLAT
Terminal Position DUAL DUAL
Transistor Application AMPLIFIER AMPLIFIER
Transistor Element Material SILICON SILICON
Base Number Matches 1 1
Part Package Code SOT
Pin Count 6
Manufacturer Package Code SOT171A
Additional Feature HIGH RELIABILITY, WITH EMITTER BALLASTING RESISTORS
Case Connection ISOLATED
Collector Current-Max (IC) 3.5 A
Collector-Emitter Voltage-Max 16 V
Power Dissipation-Max (Abs) 44 W

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