TNETV2685FIBZUTA9
vs
VCBUSAM648T9
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Yes
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
TEXAS INSTRUMENTS INC
Package Description
FBGA,
BGA,
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
14
14
Barrel Shifter
NO
NO
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
66.6 MHz
66.6 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Internal Bus Architecture
MULTIPLE
MULTIPLE
JESD-30 Code
S-PBGA-B520
S-PBGA-B520
JESD-609 Code
e1
e1
Length
19 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
4
4
Number of Terminals
520
520
Operating Temperature-Max
105 °C
90 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
FBGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, FINE PITCH
GRID ARRAY
Peak Reflow Temperature (Cel)
245
245
Seated Height-Max
3.3 mm
Supply Voltage-Max
1.26 V
1.26 V
Supply Voltage-Min
1.14 V
1.14 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
OTHER
Terminal Finish
TIN SILVER COPPER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
19 mm
uPs/uCs/Peripheral ICs Type
DIGITAL SIGNAL PROCESSOR, OTHER
DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches
1
1
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