TMS5702134DZWTQQ1
vs
TMX5702135AZWTQQ1
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
TEXAS INSTRUMENTS INC
Package Description
LFBGA,
BGA,
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
YES
YES
Address Bus Width
22
Bit Size
32
32
Boundary Scan
NO
Clock Frequency-Max
80 MHz
80 MHz
DAC Channels
NO
NO
DMA Channels
YES
YES
External Data Bus Width
16
JESD-30 Code
S-PBGA-B337
X-PBGA-B337
Length
16 mm
Moisture Sensitivity Level
3
Number of I/O Lines
144
16
Number of Terminals
337
337
On Chip Program ROM Width
8
Operating Temperature-Max
125 °C
105 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
NO
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
BGA
Package Shape
SQUARE
UNSPECIFIED
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY
Peak Reflow Temperature (Cel)
260
RAM (bytes)
262144
ROM (words)
2097152
ROM Programmability
FLASH
FLASH
Screening Level
AEC-Q100
AEC-Q100
Seated Height-Max
1.4 mm
Speed
180 MHz
180 MHz
Supply Voltage-Max
1.32 V
1.32 V
Supply Voltage-Min
1.14 V
1.14 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
16 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
MICROCONTROLLER, RISC
Base Number Matches
1
1
Part Package Code
BGA
Pin Count
337
Additional Feature
ALSO OPERATES AT 3.3 V NOMINAL I/O SUPPLY
Compare TMS5702134DZWTQQ1 with alternatives
Compare TMX5702135AZWTQQ1 with alternatives