TMS320VC5510AGGW2
vs
TMS320VC5510GGW-200
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
TEXAS INSTRUMENTS INC
Part Package Code
BGA
BGA
Package Description
BGA-240
LFBGA, BGA240,17X17,32
Pin Count
240
240
Reach Compliance Code
not_compliant
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Additional Feature
ALSO REQUIRES 3.3V SUPPLY
3.3V I/O SUPPLY
Address Bus Width
22
22
Barrel Shifter
NO
NO
Bit Size
16
16
Boundary Scan
YES
YES
Clock Frequency-Max
50 MHz
200 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
Internal Bus Architecture
MULTIPLE
MULTIPLE
JESD-30 Code
S-PBGA-B240
S-PBGA-B240
JESD-609 Code
e0
Length
15 mm
15 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
3
Number of DMA Channels
6
Number of External Interrupts
6
Number of Terminals
240
240
Number of Timers
2
On Chip Data RAM Width
16
On Chip Program ROM Width
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Equivalence Code
BGA240,17X17,32
BGA240,17X17,32
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
220
Qualification Status
Not Qualified
Not Qualified
RAM (words)
32768
163840
ROM Programmability
MROM
Seated Height-Max
1.4 mm
1.4 mm
Supply Voltage-Max
1.65 V
1.65 V
Supply Voltage-Min
1.55 V
1.55 V
Supply Voltage-Nom
1.6 V
1.6 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
Width
15 mm
15 mm
uPs/uCs/Peripheral ICs Type
DIGITAL SIGNAL PROCESSOR, OTHER
DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches
1
1
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