TMS320VC5509AGHH10
vs
TMS320VC5509AGHH
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
LFBGA,
|
BGA-179
|
| Pin Count |
179
|
179
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Additional Feature |
ALSO REQUIRES 3.3V SUPPLY
|
ALSO OPERATES AT 1.2V AND 1.35V SUPPLY
|
| Address Bus Width |
21
|
21
|
| Barrel Shifter |
NO
|
NO
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
50 MHz
|
50 MHz
|
| External Data Bus Width |
16
|
16
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Internal Bus Architecture |
MULTIPLE
|
MULTIPLE
|
| JESD-30 Code |
S-PBGA-B179
|
S-PBGA-B179
|
| Length |
12 mm
|
12 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of Terminals |
179
|
179
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFBGA
|
LFBGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.4 mm
|
1.4 mm
|
| Supply Voltage-Max |
1.65 V
|
1.65 V
|
| Supply Voltage-Min |
1.55 V
|
1.55 V
|
| Supply Voltage-Nom |
1.6 V
|
1.6 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
12 mm
|
12 mm
|
| uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, OTHER
|
DIGITAL SIGNAL PROCESSOR, OTHER
|
| Base Number Matches |
2
|
9
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
No
|
| Samacsys Manufacturer |
|
Texas Instruments
|
| Integrated Cache |
|
NO
|
| JESD-609 Code |
|
e0
|
| Moisture Sensitivity Level |
|
3
|
| Number of Timers |
|
2
|
| On Chip Data RAM Width |
|
16
|
| On Chip Program ROM Width |
|
16
|
| Package Equivalence Code |
|
BGA179,14X14,32
|
| Peak Reflow Temperature (Cel) |
|
220
|
| RAM (words) |
|
128000
|
| ROM Programmability |
|
FLASH
|
| Terminal Finish |
|
TIN LEAD
|
| Time@Peak Reflow Temperature-Max (s) |
|
20
|
|
|
|
Compare TMS320VC5509AGHH10 with alternatives
Compare TMS320VC5509AGHH with alternatives