TMS320DM8127SCYE2
vs
TMS320DM8147SCYE2
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
TEXAS INSTRUMENTS INC
TEXAS INSTRUMENTS INC
Part Package Code
BGA
BGA
Package Description
FCBGA-684
23 X 23 MM, 0.80 MM PITCH, GREEN, PLASTIC, FCBGA-684
Pin Count
684
684
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Samacsys Manufacturer
Texas Instruments
Address Bus Width
28
28
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
30 MHz
30 MHz
External Data Bus Width
16
16
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B684
S-PBGA-B684
JESD-609 Code
e1
e1
Length
23 mm
23 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
4
4
Number of DMA Channels
72
72
Number of Terminals
684
684
On Chip Data RAM Width
8
8
Operating Temperature-Max
90 °C
90 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
FBGA
FBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, FINE PITCH
GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Cel)
250
250
RAM (words)
851968
8192
Seated Height-Max
3.06 mm
3.06 mm
Speed
1000 MHz
1000 MHz
Supply Voltage-Max
1.42 V
1.42 V
Supply Voltage-Min
1.28 V
1.28 V
Supply Voltage-Nom
1.35 V
1.35 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
23 mm
23 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
1
Package Equivalence Code
BGA684,28X28,32
Qualification Status
Not Qualified
Compare TMS320DM8127SCYE2 with alternatives
Compare TMS320DM8147SCYE2 with alternatives