TMS320DM648ZUT9HK
vs
TNETV2685VIDZUTA9
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Package Description |
FBGA,
|
FBGA,
|
Reach Compliance Code |
not_compliant
|
not_compliant
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Samacsys Manufacturer |
Texas Instruments
|
|
Address Bus Width |
14
|
14
|
Barrel Shifter |
NO
|
NO
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
66.6 MHz
|
66.6 MHz
|
External Data Bus Width |
32
|
32
|
Format |
FIXED POINT
|
FIXED POINT
|
Internal Bus Architecture |
MULTIPLE
|
MULTIPLE
|
JESD-30 Code |
S-PBGA-B520
|
S-PBGA-B520
|
JESD-609 Code |
e1
|
e1
|
Length |
19 mm
|
19 mm
|
Low Power Mode |
YES
|
YES
|
Moisture Sensitivity Level |
4
|
4
|
Number of Terminals |
520
|
520
|
Operating Temperature-Max |
90 °C
|
105 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
FBGA
|
FBGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, FINE PITCH
|
GRID ARRAY, FINE PITCH
|
Peak Reflow Temperature (Cel) |
245
|
245
|
Seated Height-Max |
3.3 mm
|
3.3 mm
|
Supply Voltage-Max |
1.26 V
|
1.26 V
|
Supply Voltage-Min |
1.14 V
|
1.14 V
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
19 mm
|
19 mm
|
uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, OTHER
|
DIGITAL SIGNAL PROCESSOR, OTHER
|
Base Number Matches |
1
|
1
|
|
|
|
Compare TMS320DM648ZUT9HK with alternatives
Compare TNETV2685VIDZUTA9 with alternatives