TMS320DM648ZUT9
vs
TNETV2685FIDZUT7
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
TEXAS INSTRUMENTS INC
Part Package Code
BGA
Package Description
FCBGA-529
FBGA,
Pin Count
529
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Samacsys Manufacturer
Texas Instruments
Texas Instruments
Additional Feature
IT ALSO OPERATES AT 3.3 OR 1.8 V FOR I/O SUPPLY
Address Bus Width
32
14
Barrel Shifter
NO
NO
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
66.6 MHz
66.6 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
Internal Bus Architecture
MULTIPLE
MULTIPLE
JESD-30 Code
S-PBGA-B529
S-PBGA-B520
JESD-609 Code
e1
e1
Length
19 mm
19 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
4
4
Number of DMA Channels
64
Number of Terminals
529
520
Number of Timers
8
On Chip Data RAM Width
8
On Chip Program ROM Width
8
Operating Temperature-Max
90 °C
90 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
FBGA
FBGA
Package Equivalence Code
BGA529,23X23,32
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, FINE PITCH
GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Cel)
245
245
Qualification Status
Not Qualified
RAM (words)
8192
ROM Programmability
MROM
Seated Height-Max
3.3 mm
3.3 mm
Supply Voltage-Max
1.26 V
1.26 V
Supply Voltage-Min
1.14 V
1.14 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
TIN SILVER COPPER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
19 mm
19 mm
uPs/uCs/Peripheral ICs Type
DIGITAL SIGNAL PROCESSOR, OTHER
DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches
1
1
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