TMS320DM648CUTA6
vs
TMS320DM647ZUTD7
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
TEXAS INSTRUMENTS INC
Part Package Code
BGA
BGA
Package Description
BGA, BGA529,23X23,32
FBGA, BGA529,23X23,32
Pin Count
529
529
Reach Compliance Code
compliant
not_compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
14
32
Barrel Shifter
NO
NO
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
66.6 MHz
720 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
Internal Bus Architecture
MULTIPLE
MULTIPLE
JESD-30 Code
S-PBGA-B520
S-PBGA-B529
JESD-609 Code
e1
e1
Length
19 mm
19 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
4
4
Number of DMA Channels
64
64
Number of Terminals
520
529
Number of Timers
8
8
On Chip Data RAM Width
8
8
On Chip Program ROM Width
8
8
Operating Temperature-Max
105 °C
90 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
FBGA
Package Equivalence Code
BGA529,23X23,32
BGA529,23X23,32
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Cel)
245
245
Qualification Status
Not Qualified
Not Qualified
RAM (words)
8192
8192
ROM Programmability
MROM
MROM
Supply Voltage-Max
1.26 V
1.26 V
Supply Voltage-Min
1.14 V
1.14 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
19 mm
19 mm
uPs/uCs/Peripheral ICs Type
DIGITAL SIGNAL PROCESSOR, OTHER
DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches
1
1
Additional Feature
IT ALSO OPERATES AT 3.3 OR 1.8 V FOR I/O SUPPLY
Seated Height-Max
3.3 mm
Compare TMS320DM648CUTA6 with alternatives
Compare TMS320DM647ZUTD7 with alternatives