TMS320C6701GJC120 vs TMS320C6201BGJC-167 feature comparison

TMS320C6701GJC120 Texas Instruments

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TMS320C6201BGJC-167 Texas Instruments

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC TEXAS INSTRUMENTS INC
Part Package Code BGA
Package Description HBGA, HBGA, BGA352,26X26,50
Pin Count 352
Reach Compliance Code unknown not_compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 22
Barrel Shifter NO NO
Boundary Scan YES YES
Clock Frequency-Max 120 MHz 167 MHz
External Data Bus Width 32 32
Format FLOATING POINT FIXED POINT
Internal Bus Architecture MULTIPLE MULTIPLE
JESD-30 Code S-PBGA-B352 S-PBGA-B352
Length 35 mm 35 mm
Low Power Mode YES YES
Number of Terminals 352 352
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HBGA HBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG GRID ARRAY, HEAT SINK/SLUG
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.5 mm 3.5 mm
Supply Voltage-Max 3.46 V 1.89 V
Supply Voltage-Min 3.14 V 1.71 V
Supply Voltage-Nom 3.3 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 35 mm 35 mm
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches 1 1
Rohs Code No
Bit Size 32
Operating Temperature-Max 90 °C
Operating Temperature-Min
Package Equivalence Code BGA352,26X26,50
Peak Reflow Temperature (Cel) NOT SPECIFIED
RAM (words) 16384
Temperature Grade OTHER
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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Compare TMS320C6201BGJC-167 with alternatives