TMS320C6474FCUN
vs
TMS320C6474GUN
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Package Description |
FCBGA-561
|
FBGA, BGA561,27X27,32
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
3A991.A.2
|
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
14
|
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
|
| Clock Frequency-Max |
625 MHz
|
|
| External Data Bus Width |
32
|
|
| Format |
FLOATING POINT
|
FIXED POINT
|
| Integrated Cache |
YES
|
|
| JESD-30 Code |
S-PBGA-B561
|
S-PBGA-B561
|
| JESD-609 Code |
e1
|
|
| Length |
23 mm
|
|
| Low Power Mode |
YES
|
|
| Moisture Sensitivity Level |
4
|
|
| Number of DMA Channels |
64
|
|
| Number of Terminals |
561
|
561
|
| On Chip Data RAM Width |
8
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
FBGA
|
FBGA
|
| Package Equivalence Code |
BGA561,27X27,32
|
BGA561,27X27,32
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, FINE PITCH
|
GRID ARRAY, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
245
|
NOT SPECIFIED
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (words) |
8192
|
8192
|
| Seated Height-Max |
3.3 mm
|
|
| Speed |
1000 MHz
|
|
| Supply Voltage-Max |
1.2 V
|
|
| Supply Voltage-Min |
0.9 V
|
|
| Supply Voltage-Nom |
1.1 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
|
| Terminal Finish |
TIN SILVER COPPER
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Width |
23 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
DIGITAL SIGNAL PROCESSOR, OTHER
|
| Base Number Matches |
5
|
1
|
| Pbfree Code |
|
No
|
|
|
|
Compare TMS320C6474FCUN with alternatives
Compare TMS320C6474GUN with alternatives