TMS320C6454BGTZ
vs
TMX320C6454ZTZ8
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
TEXAS INSTRUMENTS INC
Part Package Code
BGA
BGA
Package Description
FBGA, BGA697,29X29,32
BGA,
Pin Count
697
697
Reach Compliance Code
not_compliant
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
32
Barrel Shifter
NO
NO
Bit Size
32
Boundary Scan
YES
YES
Clock Frequency-Max
50 MHz
66 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Internal Bus Architecture
MULTIPLE
MULTIPLE
JESD-30 Code
S-PBGA-B697
S-PBGA-B697
JESD-609 Code
e0
Length
24 mm
Low Power Mode
YES
NO
Moisture Sensitivity Level
4
Number of Terminals
697
697
Operating Temperature-Max
90 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
FBGA
BGA
Package Equivalence Code
BGA697,29X29,32
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, FINE PITCH
GRID ARRAY
Peak Reflow Temperature (Cel)
220
Qualification Status
Not Qualified
Not Qualified
RAM (words)
262144
Seated Height-Max
3.242 mm
Supply Voltage-Max
1.2875 V
1.89 V
Supply Voltage-Min
1.2125 V
1.71 V
Supply Voltage-Nom
1.25 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
Terminal Finish
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
Width
24 mm
uPs/uCs/Peripheral ICs Type
DIGITAL SIGNAL PROCESSOR, OTHER
DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches
3
1
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