TMX320C6454ZTZ8
vs
TMS320C6454BZTZ8
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
TEXAS INSTRUMENTS INC
Part Package Code
BGA
BGA
Package Description
BGA,
24 X 24 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, FCBGA-697
Pin Count
697
697
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
20
Barrel Shifter
NO
YES
Boundary Scan
YES
YES
Clock Frequency-Max
66 MHz
66.6 MHz
External Data Bus Width
32
64
Format
FIXED POINT
FIXED POINT
Internal Bus Architecture
MULTIPLE
MULTIPLE
JESD-30 Code
S-PBGA-B697
S-PBGA-B697
Low Power Mode
NO
NO
Number of Terminals
697
697
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
FBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max
1.89 V
1.89 V
Supply Voltage-Min
1.71 V
1.71 V
Supply Voltage-Nom
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
BALL
BALL
Terminal Position
BOTTOM
BOTTOM
uPs/uCs/Peripheral ICs Type
DIGITAL SIGNAL PROCESSOR, OTHER
DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches
1
1
Pbfree Code
Rohs Code
Bit Size
32
JESD-609 Code
e1
Length
24 mm
Moisture Sensitivity Level
4
Operating Temperature-Max
90 °C
Operating Temperature-Min
Package Equivalence Code
BGA697,29X29,32
Peak Reflow Temperature (Cel)
260
RAM (words)
32768
Seated Height-Max
3.3 mm
Temperature Grade
OTHER
Terminal Finish
TIN SILVER COPPER
Terminal Pitch
0.8 mm
Time@Peak Reflow Temperature-Max (s)
30
Width
24 mm
Compare TMX320C6454ZTZ8 with alternatives
Compare TMS320C6454BZTZ8 with alternatives