TMS320C6424ZDU4 vs TMX320C6424BZWT feature comparison

TMS320C6424ZDU4 Texas Instruments

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TMX320C6424BZWT Texas Instruments

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC TEXAS INSTRUMENTS INC
Part Package Code BGA BGA
Package Description HBGA, BGA376,22X22,40 LFBGA, BGA361,19X19,32
Pin Count 376 361
Reach Compliance Code compliant compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 32
Barrel Shifter NO NO
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 30 MHz 30 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache YES
Internal Bus Architecture MULTIPLE MULTIPLE
JESD-30 Code S-PBGA-B376 S-PBGA-B361
JESD-609 Code e1
Length 23 mm 16 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3
Number of DMA Channels 64
Number of Terminals 376 361
Number of Timers 5
On Chip Data RAM Width 8
On Chip Program ROM Width 8
Operating Temperature-Max 90 °C 90 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HBGA LFBGA
Package Equivalence Code BGA376,22X22,40 BGA361,19X19,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
RAM (words) 20480 81920
ROM Programmability MROM
Seated Height-Max 2.48 mm 1.4 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 23 mm 16 mm
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches 2 1

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