TMS28F008ASYB70CDCDE
vs
TMS28F008AVYB70CDCDL
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
TSOP
|
TSOP
|
Package Description |
TSSOP,
|
TSSOP,
|
Pin Count |
40
|
40
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
Access Time-Max |
70 ns
|
70 ns
|
Additional Feature |
BOTTOM BOOT BLOCK
|
BOTTOM BOOT BLOCK
|
Boot Block |
BOTTOM
|
BOTTOM
|
JESD-30 Code |
R-PDSO-G40
|
R-PDSO-G40
|
Length |
18.4 mm
|
18.4 mm
|
Memory Density |
8388608 bit
|
8388608 bit
|
Memory IC Type |
FLASH
|
FLASH
|
Memory Width |
16
|
16
|
Number of Functions |
1
|
1
|
Number of Terminals |
40
|
40
|
Number of Words |
524288 words
|
524288 words
|
Number of Words Code |
512000
|
512000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
512KX16
|
512KX16
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
TSSOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Programming Voltage |
3 V
|
3 V
|
Seated Height-Max |
1.2 mm
|
1.2 mm
|
Supply Current-Max |
0.03 mA
|
0.03 mA
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
DUAL
|
Type |
NOR TYPE
|
NOR TYPE
|
Width |
10 mm
|
10 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare TMS28F008ASYB70CDCDE with alternatives
Compare TMS28F008AVYB70CDCDL with alternatives