TMP68000YC-10 vs 80286-8/BZC feature comparison

TMP68000YC-10 Toshiba America Electronic Components

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80286-8/BZC Rochester Electronics LLC

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer TOSHIBA CORP ROCHESTER ELECTRONICS LLC
Part Package Code PGA
Package Description PGA, PGA,
Pin Count 68
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 23 24
Bit Size 16 16
Boundary Scan NO NO
Clock Frequency-Max 10 MHz 16.13 MHz
External Data Bus Width 16 16
Format FIXED POINT FIXED POINT
Integrated Cache NO NO
JESD-30 Code S-CPGA-P68 S-CPGA-P68
Length 26.92 mm 29.464 mm
Low Power Mode YES NO
Number of DMA Channels
Number of External Interrupts 7
Number of Serial I/Os
Number of Terminals 68 68
On Chip Data RAM Width
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code PGA PGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified
RAM (words) 0
Seated Height-Max 2.59 mm 4.953 mm
Speed 10 MHz 8 MHz
Supply Current-Max 30 mA
Supply Voltage-Max 5.25 V 5.5 V
Supply Voltage-Min 4.75 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology MOS MOS
Temperature Grade COMMERCIAL MILITARY
Terminal Form PIN/PEG PIN/PEG
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position PERPENDICULAR PERPENDICULAR
Width 26.92 mm 29.464 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR
Base Number Matches 1 2
ECCN Code 3A001.A.2.C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare TMP68000YC-10 with alternatives

Compare 80286-8/BZC with alternatives