80286-8/BZC
vs
MC68HC001CRC12
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
MOTOROLA INC
|
Part Package Code |
PGA
|
|
Package Description |
PGA, PGA68,11X11
|
PGA,
|
Pin Count |
68
|
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A001.A.2.C
|
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
24
|
24
|
Bit Size |
16
|
32
|
Boundary Scan |
NO
|
NO
|
Clock Frequency-Max |
16.13 MHz
|
12 MHz
|
External Data Bus Width |
16
|
16
|
Format |
FIXED POINT
|
FIXED POINT
|
Integrated Cache |
NO
|
NO
|
JESD-30 Code |
S-CPGA-P68
|
S-CPGA-P68
|
JESD-609 Code |
e0
|
|
Length |
29.464 mm
|
26.92 mm
|
Low Power Mode |
NO
|
NO
|
Number of DMA Channels |
|
|
Number of External Interrupts |
2
|
7
|
Number of Serial I/Os |
|
|
Number of Terminals |
68
|
68
|
On Chip Data RAM Width |
|
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-55 °C
|
-40 °C
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
PGA
|
PGA
|
Package Equivalence Code |
PGA68,11X11
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (words) |
0
|
0
|
Screening Level |
38535Q/M;38534H;883B
|
|
Seated Height-Max |
4.953 mm
|
5.16 mm
|
Speed |
8 MHz
|
12 MHz
|
Supply Current-Max |
600 mA
|
35 mA
|
Supply Voltage-Max |
5.5 V
|
5.25 V
|
Supply Voltage-Min |
4.5 V
|
4.75 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
MOS
|
CMOS
|
Temperature Grade |
MILITARY
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
PIN/PEG
|
PIN/PEG
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
PERPENDICULAR
|
PERPENDICULAR
|
Width |
29.464 mm
|
26.92 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
Base Number Matches |
2
|
2
|
|
|
|
Compare 80286-8/BZC with alternatives
Compare MC68HC001CRC12 with alternatives