TMC2210N0C3 vs 5962-8873303YX feature comparison

TMC2210N0C3 TRW Inc

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5962-8873303YX Integrated Device Technology Inc

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Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer TRW LSI PRODUCTS INC INTEGRATED DEVICE TECHNOLOGY INC
Package Description DIP, DIP64,.9 QCCN,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDIP-T64 S-XQCC-N68
JESD-609 Code e0
Number of Terminals 64 68
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code DIP QCCN
Package Equivalence Code DIP64,.9
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE CHIP CARRIER
Qualification Status Not Qualified Not Qualified
Supply Voltage-Nom 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm
Terminal Position DUAL QUAD
uPs/uCs/Peripheral ICs Type DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER
Base Number Matches 2 3
Part Package Code LCC
Pin Count 68
ECCN Code 3A001.A.2.C
Additional Feature 2 X 16 BIT DATA INPUT BUS; MULTIPLEXED OUTPUT
Boundary Scan NO
External Data Bus Width 16
Low Power Mode NO
Output Data Bus Width 35
Screening Level MIL-STD-883
Supply Voltage-Max 5.5 V
Supply Voltage-Min 4.5 V

Compare TMC2210N0C3 with alternatives

Compare 5962-8873303YX with alternatives