TMC2210N0C3
vs
5962-8873303YX
feature comparison
All Stats
Differences Only
Rohs Code
No
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
TRW LSI PRODUCTS INC
INTEGRATED DEVICE TECHNOLOGY INC
Package Description
DIP, DIP64,.9
QCCN,
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-PDIP-T64
S-XQCC-N68
JESD-609 Code
e0
Number of Terminals
64
68
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
DIP
QCCN
Package Equivalence Code
DIP64,.9
Package Shape
RECTANGULAR
SQUARE
Package Style
IN-LINE
CHIP CARRIER
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
NO LEAD
Terminal Pitch
2.54 mm
Terminal Position
DUAL
QUAD
uPs/uCs/Peripheral ICs Type
DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER
DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER
Base Number Matches
2
3
Part Package Code
LCC
Pin Count
68
ECCN Code
3A001.A.2.C
Additional Feature
2 X 16 BIT DATA INPUT BUS; MULTIPLEXED OUTPUT
Boundary Scan
NO
External Data Bus Width
16
Low Power Mode
NO
Output Data Bus Width
35
Screening Level
MIL-STD-883
Supply Voltage-Max
5.5 V
Supply Voltage-Min
4.5 V
Compare TMC2210N0C3 with alternatives
Compare 5962-8873303YX with alternatives