TMC2111B2C
vs
5962-8944602LA
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
TRW LSI PRODUCTS INC
|
RAYTHEON SEMICONDUCTOR
|
Package Description |
DIP, DIP24,.3
|
0.300 INCH, CERDIP-24
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
R-XDIP-T24
|
R-GDIP-T24
|
JESD-609 Code |
e0
|
e0
|
Max Frequency@Nom-Sup |
30000000 Hz
|
|
Number of Bits |
1
|
|
Number of Functions |
8
|
|
Number of Terminals |
24
|
24
|
Operating Temperature-Max |
70 °C
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Package Body Material |
CERAMIC
|
CERAMIC, GLASS-SEALED
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP24,.3
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Nom (Vsup) |
5 V
|
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
MILITARY
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
1
|
1
|
ECCN Code |
|
3A991.A.2
|
Additional Feature |
|
OPTEMP SPECIFIED AS TC
|
Boundary Scan |
|
NO
|
Clock Frequency-Max |
|
30 MHz
|
External Data Bus Width |
|
8
|
Length |
|
31.94 mm
|
Low Power Mode |
|
NO
|
Output Data Bus Width |
|
8
|
Screening Level |
|
MIL-STD-883
|
Seated Height-Max |
|
5.08 mm
|
Supply Current-Max |
|
40 mA
|
Supply Voltage-Max |
|
5.5 V
|
Supply Voltage-Min |
|
4.5 V
|
Supply Voltage-Nom |
|
5 V
|
Width |
|
7.62 mm
|
uPs/uCs/Peripheral ICs Type |
|
DSP PERIPHERAL, PIPELINE REGISTER
|
|
|
|
Compare TMC2111B2C with alternatives
Compare 5962-8944602LA with alternatives