TLV9004IDR
vs
MCP6004T-E/ST
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
TEXAS INSTRUMENTS INC
MICROCHIP TECHNOLOGY INC
Package Description
SOIC-14
TSSOP-14
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Samacsys Manufacturer
Texas Instruments
Microchip
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Architecture
VOLTAGE-FEEDBACK
VOLTAGE-FEEDBACK
Common-mode Reject Ratio-Min
63 dB
60 dB
Common-mode Reject Ratio-Nom
77 dB
76 dB
Frequency Compensation
YES
YES
Input Offset Voltage-Max
1600 µV
4500 µV
JESD-30 Code
R-PDSO-G14
R-PDSO-G14
JESD-609 Code
e4
e3
Length
8.65 mm
5 mm
Low-Bias
YES
YES
Low-Offset
NO
NO
Micropower
YES
YES
Moisture Sensitivity Level
2
1
Number of Functions
4
4
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
TSSOP
Package Equivalence Code
SOP14,.25
TSSOP14,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method
TR
TAPE AND REEL
Peak Reflow Temperature (Cel)
260
260
Power
NO
NO
Programmable Power
NO
NO
Seated Height-Max
1.75 mm
1.2 mm
Slew Rate-Nom
2 V/us
0.6 V/us
Supply Current-Max
0.3 mA
0.68 mA
Supply Voltage Limit-Max
6 V
7 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Matte Tin (Sn)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
40
Unity Gain BW-Nom
1000
1000
Voltage Gain-Min
158489
25118.86
Wideband
NO
NO
Width
3.9 mm
4.4 mm
Base Number Matches
2
2
Part Package Code
TSSOP
Pin Count
14
Factory Lead Time
4 Weeks
Qualification Status
Not Qualified
Compare TLV9004IDR with alternatives
Compare MCP6004T-E/ST with alternatives