TLV74118PDQNR
vs
S-1132B18-U5T1G
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
SEIKO INSTRUMENTS USA INC
|
| Package Description |
X2SON-4
|
LEAD FREE, SOT-89, 5 PIN
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Adjustability |
FIXED
|
FIXED
|
| Dropout Voltage1-Max |
0.695 V
|
0.58 V
|
| Dropout Voltage1-Nom |
0.23 V
|
0.54 V
|
| Input Voltage-Max |
5.5 V
|
6.5 V
|
| Input Voltage-Min |
2.3 V
|
2 V
|
| JESD-30 Code |
S-PDSO-N4
|
R-PDSO-F5
|
| JESD-609 Code |
e4
|
|
| Length |
1 mm
|
4.5 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
4
|
5
|
| Operating Temperature TJ-Max |
125 °C
|
|
| Operating Temperature TJ-Min |
-40 °C
|
|
| Output Current1-Max |
0.15 A
|
0.1 A
|
| Output Voltage1-Max |
1.827 V
|
1.818 V
|
| Output Voltage1-Min |
1.773 V
|
1.782 V
|
| Output Voltage1-Nom |
1.8 V
|
1.8 V
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VSON
|
HLSOF
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Regulator Type |
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
|
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
|
| Seated Height-Max |
0.4 mm
|
1.6 mm
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
|
| Terminal Form |
NO LEAD
|
FLAT
|
| Terminal Pitch |
0.65 mm
|
1.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
10
|
| Voltage Tolerance-Max |
1.5%
|
1%
|
| Width |
1 mm
|
2.5 mm
|
| Base Number Matches |
1
|
2
|
| Input Voltage Absolute-Max |
|
7 V
|
| Line Regulation-Max |
|
0.0151%
|
| Load Regulation-Max |
|
0.04%
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Equivalence Code |
|
FL6,.1,60
|
| Packing Method |
|
TR
|
| Qualification Status |
|
Not Qualified
|
| Technology |
|
CMOS
|
|
|
|
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