TLV4021R2YKAR
vs
TLV4062QDBVRQ1
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Package Description |
VFBGA,
|
LSSOP, SOP6,.11,38
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Texas Instruments
|
Texas Instruments
|
Amplifier Type |
COMPARATOR
|
COMPARATOR
|
Bias Current-Max (IIB) @25C |
0.005 µA
|
0.015 µA
|
Input Offset Voltage-Max |
4000 µV
|
6000 µV
|
JESD-30 Code |
S-XBGA-B4
|
R-PDSO-G6
|
JESD-609 Code |
e1
|
e4
|
Length |
0.73 mm
|
2.9 mm
|
Moisture Sensitivity Level |
1
|
2
|
Number of Functions |
1
|
2
|
Number of Terminals |
4
|
6
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Type |
OPEN-DRAIN
|
PUSH-PULL
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
LSSOP
|
Package Equivalence Code |
BGA4,2X2,14
|
SOP6,.11,38
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
Packing Method |
TR, 7 INCH
|
TR
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Response Time-Nom |
360 ns
|
5500 ns
|
Seated Height-Max |
0.4 mm
|
1.45 mm
|
Supply Current-Max |
0.005 mA
|
0.012 mA
|
Supply Voltage Limit-Max |
6 V
|
7 V
|
Supply Voltage-Nom (Vsup) |
1.8 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
BALL
|
GULL WING
|
Terminal Pitch |
0.35 mm
|
0.95 mm
|
Terminal Position |
BOTTOM
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
Width |
0.73 mm
|
1.6 mm
|
Base Number Matches |
1
|
1
|
Date Of Intro |
|
2020-11-01
|
Average Bias Current-Max (IIB) |
|
0.015 µA
|
Screening Level |
|
AEC-Q100
|
|
|
|
Compare TLV4021R2YKAR with alternatives
Compare TLV4062QDBVRQ1 with alternatives