TLIN10285DDARQ1
vs
MCP201-E/P
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
HSOP, SOP8,.25
|
DIP,
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Date Of Intro |
2020-08-27
|
|
| Samacsys Manufacturer |
Texas Instruments
|
Microchip
|
| Data Rate |
20 Mbps
|
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDIP-T8
|
| JESD-609 Code |
e4
|
e3
|
| Length |
4.9 mm
|
9.271 mm
|
| Moisture Sensitivity Level |
2
|
|
| Number of Channels |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Number of Transceivers |
1
|
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HSOP
|
DIP
|
| Package Equivalence Code |
SOP8,.25
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Screening Level |
AEC-Q100
|
|
| Seated Height-Max |
1.75 mm
|
5.334 mm
|
| Supply Current-Max |
300 mA
|
|
| Supply Voltage-Nom |
6.1 V
|
12 V
|
| Surface Mount |
YES
|
NO
|
| Telecom IC Type |
LIN TRANSCEIVER
|
INTERFACE CIRCUIT
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
NICKEL PALLADIUM GOLD SILVER
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
3.9 mm
|
7.62 mm
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
8
|
| Qualification Status |
|
Not Qualified
|
|
|
|
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