TLE8261-2E vs TLE9261-3BQXV33 feature comparison

TLE8261-2E Infineon Technologies AG

Buy Now Datasheet

TLE92613BQXV33XUMA2 Infineon Technologies AG

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer INFINEON TECHNOLOGIES AG INFINEON TECHNOLOGIES AG
Part Package Code SOIC
Package Description GREEN, PLASTIC, SOP-36 VQFN-48
Pin Count 36
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01
Additional Feature IT ALSO OPERATES AT 3 TO 40V
Interface IC Type INTERFACE CIRCUIT
JESD-30 Code R-PDSO-G36 S-PQCC-N48
Length 12.8 mm 7 mm
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 36 48
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HSSOP HVQCCN
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Qualification Status Not Qualified
Seated Height-Max 2.55 mm 0.9 mm
Supply Voltage-Max 28 V
Supply Voltage-Min 3 V
Supply Voltage-Nom 13.5 V 13.5 V
Surface Mount YES YES
Terminal Form GULL WING NO LEAD
Terminal Pitch 0.65 mm 0.5 mm
Terminal Position DUAL QUAD
Width 7.6 mm 7 mm
Base Number Matches 4 1
Factory Lead Time 30 Weeks
Number of Transceivers 1
Operating Temperature-Max 150 °C
Operating Temperature-Min -40 °C
Package Equivalence Code LCC48,.27SQ,20
Screening Level AEC-Q100
Supply Current-Max 6.5 mA
Telecom IC Type CAN FD, LIN TRANSCEIVER
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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