TLE6250GV33XUMA1
vs
AR8031-AL1A
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
End Of Life
|
Active
|
| Ihs Manufacturer |
INFINEON TECHNOLOGIES AG
|
QUALCOMM INC
|
| Part Package Code |
SOIC
|
QFN
|
| Package Description |
SOP,
|
QFN-48
|
| Pin Count |
8
|
48
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Infineon
|
Qualcomm
|
| JESD-30 Code |
R-PDSO-G8
|
S-XQCC-N48
|
| JESD-609 Code |
e3
|
|
| Length |
5 mm
|
6 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
48
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
SOP
|
HVQCCN
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.75 mm
|
0.8 mm
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
|
| Telecom IC Type |
CAN TRANSCEIVER
|
ETHERNET TRANSCEIVER
|
| Terminal Finish |
Tin (Sn)
|
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
0.4 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
4 mm
|
6 mm
|
| Base Number Matches |
1
|
2
|
| Data Rate |
|
1000000 Mbps
|
| Number of Transceivers |
|
1
|
| Operating Temperature-Max |
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Equivalence Code |
|
LCC48,.24SQ,16
|
| Supply Current-Max |
|
113.7 mA
|
| Temperature Grade |
|
COMMERCIAL
|
|
|
|
Compare TLE6250GV33XUMA1 with alternatives
Compare AR8031-AL1A with alternatives