TLE6250C
vs
UJA1167TK
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
End Of Life
|
Obsolete
|
Ihs Manufacturer |
INFINEON TECHNOLOGIES AG
|
NXP SEMICONDUCTORS
|
Part Package Code |
DIE
|
|
Package Description |
DIE,
|
4.50 X 3 MM, 0.85 MM HEIGHT, GREEN, PLASTIC, MO-229, SOT1086-2, HVSON-14
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
X-XUUC-N
|
R-PDSO-N14
|
JESD-609 Code |
e3
|
|
Number of Functions |
1
|
1
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
DIE
|
HVSON
|
Package Shape |
UNSPECIFIED
|
RECTANGULAR
|
Package Style |
UNCASED CHIP
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
Qualification Status |
Not Qualified
|
|
Supply Voltage-Nom |
5 V
|
13 V
|
Surface Mount |
YES
|
YES
|
Technology |
BCDMOS
|
|
Telecom IC Type |
CAN TRANSCEIVER
|
|
Terminal Finish |
MATTE TIN
|
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Position |
UPPER
|
DUAL
|
Base Number Matches |
5
|
4
|
Samacsys Manufacturer |
|
NXP
|
Interface IC Type |
|
INTERFACE CIRCUIT
|
Length |
|
4.5 mm
|
Number of Terminals |
|
14
|
Screening Level |
|
AEC-Q100
|
Seated Height-Max |
|
1 mm
|
Supply Voltage-Max |
|
28 V
|
Supply Voltage-Min |
|
3 V
|
Terminal Pitch |
|
0.65 mm
|
Width |
|
3 mm
|
|
|
|
Compare TLE6250C with alternatives
Compare UJA1167TK with alternatives