TLE6250C vs UJA1167TK feature comparison

TLE6250C Infineon Technologies AG

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UJA1167TK NXP Semiconductors

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Rohs Code Yes
Part Life Cycle Code End Of Life Obsolete
Ihs Manufacturer INFINEON TECHNOLOGIES AG NXP SEMICONDUCTORS
Part Package Code DIE
Package Description DIE, 4.50 X 3 MM, 0.85 MM HEIGHT, GREEN, PLASTIC, MO-229, SOT1086-2, HVSON-14
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code X-XUUC-N R-PDSO-N14
JESD-609 Code e3
Number of Functions 1 1
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code DIE HVSON
Package Shape UNSPECIFIED RECTANGULAR
Package Style UNCASED CHIP SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Qualification Status Not Qualified
Supply Voltage-Nom 5 V 13 V
Surface Mount YES YES
Technology BCDMOS
Telecom IC Type CAN TRANSCEIVER
Terminal Finish MATTE TIN
Terminal Form NO LEAD NO LEAD
Terminal Position UPPER DUAL
Base Number Matches 5 4
Samacsys Manufacturer NXP
Interface IC Type INTERFACE CIRCUIT
Length 4.5 mm
Number of Terminals 14
Screening Level AEC-Q100
Seated Height-Max 1 mm
Supply Voltage-Max 28 V
Supply Voltage-Min 3 V
Terminal Pitch 0.65 mm
Width 3 mm

Compare TLE6250C with alternatives

Compare UJA1167TK with alternatives