TLE6250C
vs
PCA82C250N
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
End Of Life
|
Obsolete
|
| Ihs Manufacturer |
INFINEON TECHNOLOGIES AG
|
NXP SEMICONDUCTORS
|
| Part Package Code |
DIE
|
DIP
|
| Package Description |
DIE,
|
PLASTIC, DIP-8
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
X-XUUC-N
|
R-PDIP-T8
|
| JESD-609 Code |
e3
|
|
| Number of Functions |
1
|
1
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
DIE
|
DIP
|
| Package Shape |
UNSPECIFIED
|
RECTANGULAR
|
| Package Style |
UNCASED CHIP
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
BCDMOS
|
|
| Telecom IC Type |
CAN TRANSCEIVER
|
INTERFACE CIRCUIT
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
| Terminal Position |
UPPER
|
DUAL
|
| Base Number Matches |
5
|
3
|
| Pbfree Code |
|
Yes
|
| Pin Count |
|
8
|
| Length |
|
9.5 mm
|
| Number of Terminals |
|
8
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Peak Reflow Temperature (Cel) |
|
250
|
| Seated Height-Max |
|
4.2 mm
|
| Temperature Grade |
|
AUTOMOTIVE
|
| Terminal Pitch |
|
2.54 mm
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
| Width |
|
7.62 mm
|
|
|
|
Compare TLE6250C with alternatives
Compare PCA82C250N with alternatives