TLC5943RHBTG4
vs
HPA00030DAPR
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
QFN
|
|
| Package Description |
HVQCCN, LCC32,.2SQ,20
|
HTSSOP,
|
| Pin Count |
32
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Data Input Mode |
SERIAL
|
SERIAL
|
| Interface IC Type |
LED DISPLAY DRIVER
|
LED DISPLAY DRIVER
|
| JESD-30 Code |
S-PQCC-N32
|
R-PDSO-G32
|
| JESD-609 Code |
e4
|
e4
|
| Length |
5 mm
|
11 mm
|
| Moisture Sensitivity Level |
2
|
3
|
| Number of Functions |
1
|
1
|
| Number of Segments |
16
|
16
|
| Number of Terminals |
32
|
32
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
HTSSOP
|
| Package Equivalence Code |
LCC32,.2SQ,20
|
TSSOP32,.3
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1 mm
|
1.2 mm
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
3.3 V
|
3 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.65 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Width |
5 mm
|
6.1 mm
|
| fmax-Min |
30 MHz
|
30 MHz
|
| Base Number Matches |
1
|
1
|
| Multiplexed Display Capability |
|
NO
|
|
|
|
Compare TLC5943RHBTG4 with alternatives
Compare HPA00030DAPR with alternatives