TLC556MDREP
vs
KA555
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
SAMSUNG SEMICONDUCTOR INC
Part Package Code
SOIC
DIP
Package Description
SOP,
0.300 INCH, DIP-8
Pin Count
14
8
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
IT CAN ALSO OPERATE AT 15V NOMINAL
Analog IC - Other Type
PULSE; RECTANGULAR
PULSE; RECTANGULAR
JESD-30 Code
R-PDSO-G14
R-PDIP-T8
JESD-609 Code
e4
Length
8.65 mm
9.2 mm
Number of Functions
2
1
Number of Terminals
14
8
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Output Frequency-Max
1.2 MHz
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
5.08 mm
Supply Voltage-Max (Vsup)
15 V
16 V
Supply Voltage-Min (Vsup)
2 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
15 V
Surface Mount
YES
NO
Technology
CMOS
BIPOLAR
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
NICKEL PALLADIUM GOLD
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
3.9 mm
7.62 mm
Base Number Matches
1
5
Package Equivalence Code
DIP8,.3
Supply Current-Max (Isup)
15 mA
Compare TLC556MDREP with alternatives
Compare KA555 with alternatives