TLC556CDG4
vs
KA555
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
SAMSUNG SEMICONDUCTOR INC
Part Package Code
SOIC
DIP
Package Description
SOP, SOP14,.25
0.300 INCH, DIP-8
Pin Count
14
8
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Texas Instruments
Additional Feature
IT CAN ALSO OPERATE AT 2V OR 15V NOMINALS
Analog IC - Other Type
PULSE; RECTANGULAR
PULSE; RECTANGULAR
JESD-30 Code
R-PDSO-G14
R-PDIP-T8
JESD-609 Code
e4
Length
8.65 mm
9.2 mm
Moisture Sensitivity Level
1
Number of Functions
2
1
Number of Terminals
14
8
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Output Frequency-Max
1.2 MHz
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
DIP
Package Equivalence Code
SOP14,.25
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
5.08 mm
Supply Current-Max (Isup)
1 mA
15 mA
Supply Voltage-Max (Vsup)
15 V
16 V
Supply Voltage-Min (Vsup)
2 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
15 V
Surface Mount
YES
NO
Technology
CMOS
BIPOLAR
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
3.9 mm
7.62 mm
Base Number Matches
1
5
Compare TLC556CDG4 with alternatives
Compare KA555 with alternatives