TLC372MJGB vs TS372CN feature comparison

TLC372MJGB Texas Instruments

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TS372CN STMicroelectronics

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Pbfree Code Yes
Rohs Code No Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC STMICROELECTRONICS
Part Package Code DIP DIP
Package Description DIP, DIP8,.3 PLASTIC, DIP-8
Pin Count 8 8
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Texas Instruments STMicroelectronics
Amplifier Type COMPARATOR COMPARATOR
Average Bias Current-Max (IIB) 0.02 µA 0.00015 µA
Bias Current-Max (IIB) @25C 0.00003 µA
Input Offset Voltage-Max 5000 µV 12000 µV
JESD-30 Code R-GDIP-T8 R-PDIP-T8
JESD-609 Code e0 e3
Length 9.58 mm
Number of Functions 2 2
Number of Terminals 8 8
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Output Type OPEN-COLLECTOR; OPEN-DRAIN OPEN-DRAIN
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP8,.3 DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Packing Method TUBE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Response Time-Nom 650 ns 600 ns
Screening Level MIL-STD-883
Seated Height-Max 5.08 mm 5.08 mm
Supply Current-Max 0.3 mA 1 mA
Supply Voltage Limit-Max 18 V 18 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) MATTE TIN
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
Neg Supply Voltage Limit-Max
Neg Supply Voltage-Nom (Vsup)

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Compare TS372CN with alternatives