TL16C2552RHB
vs
SC28L202A1DGG,518
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
QFN
|
TSSOP
|
| Package Description |
HVQCCN, LCC32,.2SQ,20
|
6.10 MM, PLASTIC, MO-153, SOT364-1, TSSOP-56
|
| Pin Count |
32
|
56
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Additional Feature |
ALSO OPERATES AT 1.8V/2.5V/3.3V SUPPLY
|
ALSO OPERATES AT 3.3V SUPPLY
|
| Address Bus Width |
3
|
7
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
24 MHz
|
50 MHz
|
| Communication Protocol |
ASYNC, BIT; ETHERNET
|
ASYNC, BIT
|
| Data Transfer Rate-Max |
0.1875 MBps
|
0.375 MBps
|
| External Data Bus Width |
8
|
8
|
| JESD-30 Code |
S-PQCC-N32
|
R-PDSO-G56
|
| Length |
5 mm
|
14 mm
|
| Low Power Mode |
NO
|
YES
|
| Number of Serial I/Os |
2
|
2
|
| Number of Terminals |
32
|
56
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
TSSOP
|
| Package Equivalence Code |
LCC32,.2SQ,20
|
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
1.2 mm
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
5 mm
|
6.1 mm
|
| uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| Manufacturer Package Code |
|
SOT364-1
|
| Factory Lead Time |
|
16 Weeks
|
| Bus Compatibility |
|
68XXX; 80XXX
|
| Data Encoding/Decoding Method |
|
NRZ
|
| JESD-609 Code |
|
e4
|
| Moisture Sensitivity Level |
|
3
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Terminal Finish |
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
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