TL082MJG
vs
TL072ACN
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA SEMICONDUCTOR PRODUCTS
STMICROELECTRONICS
Package Description
DIP, DIP8,.3
DIP, DIP8,.3
Reach Compliance Code
unknown
not_compliant
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Architecture
VOLTAGE-FEEDBACK
VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB)
0.0002 µA
0.02 µA
Bias Current-Max (IIB) @25C
0.0002 µA
0.0002 µA
Common-mode Reject Ratio-Min
80 dB
Common-mode Reject Ratio-Nom
100 dB
86 dB
Frequency Compensation
YES
YES
Input Offset Voltage-Max
9000 µV
7000 µV
JESD-30 Code
R-XDIP-T8
R-PDIP-T8
JESD-609 Code
e0
e3
Length
10.415 mm
9.27 mm
Low-Bias
YES
YES
Low-Offset
NO
NO
Neg Supply Voltage Limit-Max
-18 V
-18 V
Neg Supply Voltage-Nom (Vsup)
-15 V
-15 V
Number of Functions
2
2
Number of Terminals
8
8
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Package Body Material
CERAMIC
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP8,.3
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Power Supplies
+-15 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
5.33 mm
Slew Rate-Min
8 V/us
8 V/us
Slew Rate-Nom
13 V/us
16 V/us
Supply Current-Max
5.6 mA
2.5 mA
Supply Voltage Limit-Max
18 V
18 V
Supply Voltage-Nom (Vsup)
15 V
15 V
Surface Mount
NO
NO
Technology
JFET
BIPOLAR
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
MATTE TIN
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Unity Gain BW-Nom
4000
4000
Voltage Gain-Min
50000
25000
Width
7.62 mm
7.62 mm
Base Number Matches
6
1
Part Package Code
DIP
Pin Count
8
ECCN Code
EAR99
HTS Code
8542.33.00.01
Samacsys Manufacturer
STMicroelectronics
Input Offset Current-Max (IIO)
0.004 µA
Packing Method
TUBE
Compare TL082MJG with alternatives
Compare TL072ACN with alternatives