TJA1100HNZ
vs
AR8031-AL1B-R
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Not Recommended
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
QUALCOMM INC
|
| Part Package Code |
QFN
|
QFN
|
| Package Description |
HVQFN-36
|
QFN-48
|
| Pin Count |
36
|
48
|
| Manufacturer Package Code |
SOT1092-2
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
5A991
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
15 Weeks
|
|
| Samacsys Manufacturer |
NXP
|
Qualcomm
|
| JESD-30 Code |
S-PQCC-N36
|
S-XQCC-N48
|
| JESD-609 Code |
e4
|
|
| Length |
6 mm
|
6 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
36
|
48
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Screening Level |
AEC-Q100
|
|
| Seated Height-Max |
1 mm
|
0.8 mm
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET TRANSCEIVER
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Finish |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
|
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.4 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
6 mm
|
6 mm
|
| Base Number Matches |
1
|
2
|
| Data Rate |
|
1000000 Mbps
|
| Number of Transceivers |
|
1
|
| Package Equivalence Code |
|
LCC48,.24SQ,16
|
| Supply Current-Max |
|
113.7 mA
|
|
|
|
Compare TJA1100HNZ with alternatives
Compare AR8031-AL1B-R with alternatives