TJA1054T/S900/VM
vs
TJA1054U/N1
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Part Package Code |
SOIC
|
DIE
|
Package Description |
SOP,
|
DIE,
|
Pin Count |
14
|
15
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
R-PDSO-G14
|
R-XUUC-N15
|
JESD-609 Code |
e4
|
|
Length |
8.65 mm
|
|
Moisture Sensitivity Level |
3
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
14
|
15
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Code |
SOP
|
DIE
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
UNCASED CHIP
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.75 mm
|
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
Terminal Finish |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
|
|
Terminal Form |
GULL WING
|
NO LEAD
|
Terminal Pitch |
1.27 mm
|
|
Terminal Position |
DUAL
|
UPPER
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
3.9 mm
|
|
Base Number Matches |
1
|
1
|
Samacsys Manufacturer |
|
NXP
|
Operating Temperature-Max |
|
125 °C
|
Operating Temperature-Min |
|
-40 °C
|
Temperature Grade |
|
AUTOMOTIVE
|
|
|
|
Compare TJA1054T/S900/VM with alternatives
Compare TJA1054U/N1 with alternatives