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TJA1054T/S900/VM vs TJA1054T/S900/VM:5 feature comparison

TJA1054T/S900/VM NXP Semiconductors

Buy Now Datasheet

TJA1054T/S900/VM:5 NXP Semiconductors

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SOIC SOIC
Package Description SOP, 3.90 MM, ROHS COMPLIANT, PLASTIC, MS-012, SOT108-1, SOP-14
Pin Count 14 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e4
Length 8.65 mm 8.65 mm
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 14 14
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Telecom IC Type INTERFACE CIRCUIT INTERFACE CIRCUIT
Terminal Finish Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) NICKEL PALLADIUM GOLD SILVER
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 40
Width 3.9 mm 3.9 mm
Base Number Matches 1 1
Telecommunication Circuits » Network Interfaces
Telecommunication Circuits » Network Interfaces

Compare TJA1054T/S900/VM with alternatives

Compare TJA1054T/S900/VM:5 with alternatives