TJA1052IT/5Y
vs
1042BG
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
AT & T MICROELECTRONICS
|
Part Package Code |
SOP
|
|
Package Description |
SOP-16
|
,
|
Pin Count |
16
|
|
Manufacturer Package Code |
SOT162-1
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
10 Weeks
|
|
Samacsys Manufacturer |
NXP
|
|
JESD-30 Code |
R-PDSO-G16
|
S-PQCC-J68
|
JESD-609 Code |
e4
|
|
Length |
10.3 mm
|
|
Moisture Sensitivity Level |
3
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
16
|
68
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
QCCJ
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
SMALL OUTLINE
|
CHIP CARRIER
|
Peak Reflow Temperature (Cel) |
260
|
|
Screening Level |
AEC-Q100
|
|
Seated Height-Max |
2.65 mm
|
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
Temperature Grade |
AUTOMOTIVE
|
OTHER
|
Terminal Finish |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
|
|
Terminal Form |
GULL WING
|
J BEND
|
Terminal Pitch |
1.27 mm
|
|
Terminal Position |
DUAL
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
7.5 mm
|
|
Base Number Matches |
1
|
1
|
Qualification Status |
|
Not Qualified
|
|
|
|
Compare TJA1052IT/5Y with alternatives
Compare 1042BG with alternatives