TJA1043TKY
vs
935261511005
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Not Recommended
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
SON
DIE
Package Description
3 X 4.50 MM, 0.85 MM HEIGHT,GREEN, PLASTIC, MO-229, SOT1086-2, HVSON-14
DIE,
Pin Count
14
15
Manufacturer Package Code
SOT1086-2
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
10 Weeks
Samacsys Manufacturer
NXP
Data Rate
1000 Mbps
JESD-30 Code
R-PDSO-G14
R-XUUC-N15
JESD-609 Code
e4
Length
4.5 mm
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
14
15
Number of Transceivers
1
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
HVSSOP
DIE
Package Equivalence Code
SOLCC14,.12,25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH
UNCASED CHIP
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Screening Level
AEC-Q100
Seated Height-Max
1 mm
Supply Current-Max
65 mA
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Telecom IC Type
INTERFACE CIRCUIT
INTERFACE CIRCUIT
Terminal Finish
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
0.65 mm
Terminal Position
DUAL
UPPER
Time@Peak Reflow Temperature-Max (s)
30
NOT SPECIFIED
Width
3 mm
Base Number Matches
1
1
Compare TJA1043TKY with alternatives
Compare 935261511005 with alternatives