TJA1027TK/20/1J
vs
MCP201-I/MF
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
SON
|
DFN
|
| Pin Count |
8
|
8
|
| Manufacturer Package Code |
SOT782-1
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| Factory Lead Time |
10 Weeks
|
|
| Samacsys Manufacturer |
NXP
|
|
| JESD-30 Code |
S-PDSO-N8
|
R-PDSO-N8
|
| Length |
3 mm
|
5.99 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVSON
|
HVSON
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Screening Level |
AEC-Q100
|
|
| Seated Height-Max |
1 mm
|
1 mm
|
| Supply Voltage-Nom |
12 V
|
12 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
LIN TRANSCEIVER
|
INTERFACE CIRCUIT
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.65 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
3 mm
|
4.92 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Package Description |
|
HVSON,
|
| HTS Code |
|
8542.39.00.01
|
| JESD-609 Code |
|
e3
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Qualification Status |
|
Not Qualified
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
MATTE TIN
|
|
|
|
Compare TJA1027TK/20/1J with alternatives
Compare MCP201-I/MF with alternatives