TIP110
vs
TIP110
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
MOTOROLA INC
Part Package Code
SFM
Package Description
TO-220, 3 PIN
FLANGE MOUNT, R-PSFM-T3
Pin Count
3
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
Collector Current-Max (IC)
2 A
2 A
Collector-Emitter Voltage-Max
60 V
60 V
Configuration
DARLINGTON WITH BUILT-IN DIODE AND RESISTOR
DARLINGTON WITH BUILT-IN DIODE AND RESISTOR
DC Current Gain-Min (hFE)
500
500
JEDEC-95 Code
TO-220AB
TO-220AB
JESD-30 Code
R-PSFM-T3
R-PSFM-T3
Number of Elements
1
1
Number of Terminals
3
3
Operating Temperature-Max
150 °C
150 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLANGE MOUNT
FLANGE MOUNT
Polarity/Channel Type
NPN
NPN
Power Dissipation-Max (Abs)
50 W
50 W
Qualification Status
Not Qualified
Not Qualified
Surface Mount
NO
NO
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
SINGLE
SINGLE
Transistor Element Material
SILICON
SILICON
Base Number Matches
1
17
HTS Code
8541.29.00.95
Additional Feature
LEADFORM OPTIONS ARE AVAILABLE
Case Connection
COLLECTOR
Collector-Base Capacitance-Max
100 pF
JESD-609 Code
e0
Power Dissipation Ambient-Max
50 W
Terminal Finish
Tin/Lead (Sn/Pb)
Transistor Application
AMPLIFIER
Transition Frequency-Nom (fT)
25 MHz
VCEsat-Max
2.5 V
Compare TIP110 with alternatives
Compare TIP110 with alternatives