TIC226N vs BT137-800,127 feature comparison

TIC226N Comset Semiconductor

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BT137-800,127 NXP Semiconductors

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Part Life Cycle Code Contact Manufacturer Transferred
Ihs Manufacturer COMSET SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description , PLASTIC, SC-46, 3 PIN
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
Base Number Matches 6 2
Rohs Code Yes
Part Package Code TO-220
Pin Count 3
Manufacturer Package Code SOT78
HTS Code 8541.30.00.80
Factory Lead Time 4 Weeks
Additional Feature SENSITIVE GATE
Case Connection MAIN TERMINAL 2
Configuration SINGLE
Critical Rate of Rise of Off-State Voltage-Min 100 V/us
DC Gate Trigger Current-Max 35 mA
DC Gate Trigger Voltage-Max 1.5 V
Holding Current-Max 20 mA
JEDEC-95 Code TO-220AB
JESD-30 Code R-PSFM-T3
JESD-609 Code e3
Leakage Current-Max 0.5 mA
Number of Elements 1
Number of Terminals 3
Operating Temperature-Max 125 °C
Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR
Package Style FLANGE MOUNT
Qualification Status Not Qualified
RMS On-state Current-Max 8 A
Repetitive Peak Off-state Leakage Current-Max 500 µA
Repetitive Peak Off-state Voltage 800 V
Surface Mount NO
Terminal Finish TIN
Terminal Form THROUGH-HOLE
Terminal Position SINGLE
Trigger Device Type 4 QUADRANT LOGIC LEVEL TRIAC

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